HBM
Samsung
In stock
HBM3 24GB
Next-generation HBM for the most demanding AI and HPC workloads.
Part number: DJ-HBM3-24G
Capacity24GB
InterfaceHBM3
Speed6.4 Gbps
Voltage1.1V
Temperature0°C to 95°C
Form factorStacked die
Overview
Built for dependable integration
Next-generation HBM for the most demanding AI and HPC workloads.
- 6.4 Gbps per pin
- High stack density
- Advanced thermal design
Technical specifications
| Part number | DJ-HBM3-24G |
|---|---|
| Brand | Samsung |
| Category | HBM |
| Capacity | 24GB |
| Interface | HBM3 |
| Speed | 6.4 Gbps |
| Voltage | 1.1V |
| Operating temperature | 0°C to 95°C |
| Form factor | Stacked die |
| Availability | In stock |
| Stack | 12-high |
| Bus width | 1024-bit |
Selection guide
HBM series comparison
HBM stacks deliver extremely high bandwidth in a compact footprint for data centre accelerators and high-performance computing.
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